SYS-SLD500B-S (Offline M/C) |
Automatic Offline Selective Soldering Machine |
Max. Board Size
Machine Dimensions |
600 x 500 mm(23.6" x 20")
1,800mm(W) x 1,525mm(D) x 1,370mm(H) ; TOWER LAMP 제외 높이 |
Min. Neighbor Component Clearance
|
1.5 - 3 mm
0.06" - 0.12" |
Pre-heater: |
Top : 1.5 KW - 8 KW
Bottom : 1 KW |
Solder Module Capacity |
12 kg
22lbs / Solder Module |
Flux System |
Micro Drop Jet Type |
Solder Pot and Pump System |
Full Titanium (Suitable for all alloys) |
Heat Up Time |
60 minute |
Max. Temperature |
320 °C |
Nitrogen Consumption and Purity |
20 L/min, Adjustable 99.99% |
Air Pressure |
3 bar
43.5 psi |